Organometallic tin clusters as EUV photoresist

Inventor: Feng Lu

Patent Publication Number: US 20240134275 A1

Publication date: 2024-04-25

Abstract

Organometallic tin clusters represented by chemical formulas [(C3RSn)12014(OH)]X2, [(C$R3Sn)12014(OH)4(L)2] X2, or [(C3R3Sn(O)O₂CR'] and their uses as extreme ultraviolet (EUV) lithography photoresists are descried, wherein CR, comprises cyclopentadienyl CH3 group, or substituted cyclopentadienyl C3H&R, C3H3R2, C3H3R3, CHR4, or CR group.