Organometallic tin compounds as EUV photoresist

Inventor: Feng Lu

Patent Patent Number: US-11827659-B2

Date of Patent: 2023-11-28

Access Link: USPTO

Abstract

The present disclosure is related to organometallic sandwich and half-sandwich tin (bearing n³-C-Sn π bond) compounds as extreme ultraviolet (EUV) photoresist. Organometallic sandwich di(cyclopentadienyl)tin dialkoxide represented by the chemical formula (n³-CR),Sn(OR¹)(OR²), or half-sandwich (cyclopentadienyl)tin triamide represented by the chemical formula (n³-CR)Sn(NR¹2(NR²)(NR³2) are described including the methods for preparation and purification, wherein R¹, R2, R3 are independently H, linear or branched alkyl, alkenyl, alkynyl, or cycloalkyl group with 1 to 20 carbon atoms, or aryl group with 6-20 carbon atoms. Sandwich and half-sandwich groups comprise cyclopentadienyl (C3H3), or substituted cyclopentadienyl (n³-CH4R, 1-C,H3R2, N³-C,H2R3, 1-C3HR4, or n²-C,R,). The solution compositions of organometallic sandwich and halfsandwich tin (bearing n-C, Sn a bond) compounds are suitable for EUV photoresists, and/or the precursors of EUV photoresists for radiation sensitive coating and forming nanoscale patterns through photolithography.