Organometallic tin compounds as EUV photoresist

Inventor: Feng Lu

Patent Number: US-12195487-B2

Date of Patent: 2025-01-14

Access Link: USPTO

Abstract

The present disclosure is related to organometallic sandwich and half-sandwich tin (bearing n-C, Sn a bond) compounds as extreme ultraviolet (EUV) photoresist. Organometallic half-sandwich (n³ cyclopentadienyl) tin hydroxideoxide represented by the chemical formula (n²2-C3R3)SnO(OH) is described including the methods for preparation and purification, wherein R is H, an alkyl, alkenyl, alkynyl, or cycloalkyl group with1 to 20 carbon atoms, or an aryl group with 6-20 carbon atoms. Cyclopentadienyl comprises (CHs), or substituted n³-cyclopentadienyl ³-CHR, n³-CH3R2, n³-CH₂R3, n³-C3HR4, and or n5-CR5. The solution compositions of organometallic sandwich and halfsandwich tin (bearing n-C, Sn a bond) compounds are suitable for EUV photoresists, and/or as the precursors of EUV photoresists for radiation sensitive coating and forming nanoscale patterns through photolithography.